Meet RPC Ace at SWOP - Shanghai World of Packaging 2017

Did you know that RPC Superfos has a toolmaking sister division in China? At the upcoming SWOP trade fair, you have the opportunity to meet with RPC Ace, a market leader in mould design and manufacture. RPC Superfos will be represented as well.

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From 7 to 10 November, Shanghai New International Convention Centre will host the leading processing and packaging trade fair, Shanghai World of Packaging, SWOP 2017. This exciting event brings you the opportunity to connect directly with RPC Ace, a toolmaking division within the RPC Group and, as such, an RPC Superfos sister division. 

RPC Ace will be present at Hall W3, booth A41, where Food & Beverage is among the focus areas. Our trade fair team is eager to meet you there and introduce you to RPC Ace’s market-leading expertise in mould design and manufacture in China.

Ultralight with impressive strength
High-quality tools and moulds from RPC Ace allow RPC Superfos to manufacture various bespoke packaging solutions for food producers, for instance the Thin Wall Packaging (TWP) type, typically used for desserts, salads and yellow fats.

Following the technical principles of the SuperLight™ cups, TWP solutions from RPC Superfos have a very thin wall thickness yet feature impressive strength in a wealth of sizes and several diameters. Certainly, you have the opportunity to take a closer look at samples of it, both from the SuperLight™ range and bespoke solutions created for various international food producers.  

Matches the sustainability trend
Benny Nielsen, Executive Vice President and Technology Director of RPC Superfos, will also be at SWOP 2017 and will be delighted to schedule a face-to-face meeting with you:

“The trade fair in Shanghai is a brilliant opportunity for food producers to discuss the creation of a perfectly formed and fit-for-purpose product. We see a growing trend for using less virgin material for plastic packaging, and the TWP solutions are ideal in this connection due to their sustainable qualities. With the tools and know-how from RPC Ace we can accommodate virtually any request.”

At SWOP 2017, RPC Superfos also showcases samples of the SuperLock® pot featuring long shelf life for convenience food products under ambient temperatures. This is possible thanks to In-Mould labels with oxygen barrier protection. Another convincing option is the EasySnacking™ cup ‒ a sleek eating-on-the-go solution with an integral spoon in the lid. The versatile and ever popular UniPak packaging solution will be on display too ‒ it may be just the one you are looking for?

Whatever the nature of your next packaging project, RPC Ace and RPC Superfos hope to see you at SWOP 2017 where you can expand your global network and gain insight into future packaging trends. Make sure to include Hall W3, booth A41 in your SWOP experience!